552110 -OEChem-03010813472D 7 5 0 0 0 0 0 0 0999 V2000 0.6600 -0.6339 0.0000 Cu 0 0 0 0 0 0 0 0 0 0 0 0 1.0000 0.8460 0.0000 O 0 0 0 0 0 0 0 0 0 0 0 0 -1.5000 -0.0199 0.0000 O 0 0 0 0 0 0 0 0 0 0 0 0 -0.4999 1.7120 0.0000 O 0 0 0 0 0 0 0 0 0 0 0 0 0.0000 -0.8860 0.0000 O 0 0 0 0 0 0 0 0 0 0 0 0 0.0000 0.8460 0.0000 C 0 0 0 0 0 0 0 0 0 0 0 0 -0.5000 -0.0199 0.0000 C 0 0 0 0 0 0 0 0 0 0 0 0 2 6 2 0 0 0 0 3 7 2 0 0 0 0 4 6 1 0 0 0 0 5 7 1 0 0 0 0 6 7 1 0 0 0 0 M END > 0 > 0 > 552110 > 2 > DTP/NCI > 86015 > DTP/NCI from molfile. Release-June 2007. Structure Evaluation:No Comparision - Unparameterized Atom - Cu. Deposition record created from database webdb on host dtpiv1.ncifcrf.gov on Feb 22, 2008 > 814-91-5 Copper oxalate Copper oxalate(CuC2O4) Copper(II) oxalate Cupric oxalate Cupric oxalate (1:1) Ethanedioic acid, copper(2+) salt (1:1) NSC86015 Oxalic acid copper(2+) salt (1:1) Oxalic acid, copper(2+) salt (1:1) > 814-91-5 > 86015 > http://dtp.nci.nih.gov/ > http://dtp.nci.nih.gov/dtpstandard/servlet/dwindex?searchtype=NSC&outputformat=html&searchlist=86015 > 24189220 1 971 2 23978 2 $$$$